ELEP HOLDER ELP WS-01
描述
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This tape is used for semiconductor wafer dicing process.
ELP WS-01 is UV curable adhesive tape. It support for the dicing process of semiconductor wafer manufacturing. Before UV tape hold the wafer firmly at dicing process. After UV tape release die easily at diebonding process.
Structure
Feature
•Good adhesion stability in applied state (after taping).
•Good pick-up ability and excellent chipping performance.
•Applicable for wide range die size.
Standard Size
| Thickness [mm] | Width [mm] | Length [m] | Color |
| 0.075 | 300,400 | 100 | half transparent |
*For other sizes, please contact us.
Properties
| Item | Unit | ELP WS-01 |
|
| Thickness | mm | 0.075 | |
| Adhesive strength on Siwfer |
Before UV |
N/20mm |
7.00 |
| After UV |
N/20mm |
0.10 | |
ELEP HOLDER ELP WS-01
促销价格$0.00
原价 (/)
