PI Carrier Adhesive Tape AS-020PI12
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Bonding electric exterior components
Superior adhesion to various substrates. Thin polyimide base film can contribute for the thinner devise design
Features
- Superior adhesion to various substrates
- Thin polyimide base film can contribute for the thinner devise design.
Structure
Properties
Tape thickness[mm] | 0.03 |
180 degrees peeling adhesion[N/20mm] | 6.7 |
Holding power[mm] | 0.02 |
Applications
- Bonding electric exterior components.
PI Carrier Adhesive Tape AS-020PI12
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