Semiconductor Production Process Film NITOFLON™ Release Film for Molding Process MPS Series

Name: Semiconductor Production Process Film NITOFLON™ Release Film for Molding Process MPS Series
Brand: Hong Teck Hin
Availability: OutOfStock

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MPS series are PTFE release film products for molding process with superior heat resistance and releasability.

Features

Recommended operating temperature range is from -100℃ to 260℃ for continuous use, and can be used even in higher temperature for a short period.
Adhesive substances would hardly attached to the film, and even if it attaches, it can be ealisiy removed.
Product lineups are Standard type, Low thermal expansion type, and High-strength/high thermal contraction type.

Structure

Applications

Mold release during semiconductor chip resin sealing
Releasing from resin
Protect mold from sticking excess sealing resin
Reduce solvent

Properties

Property		Unit	(Nitto)PTFE Film t0.05mm
Property		Unit	MPS-10	MPS-11	MPS-13
Tensile Strenght	MD	MPa	50	58	79
Tensile Strenght	TD	MPa	40	38	39
Elongation	MD	％	300	258	120
Elongation	TD	％	340	351	335
Coefficient of thermal Expansion	MD	10^-6/℃	0	33	-527
Coefficient of thermal Expansion	TD	10^-6/℃	333	186	219
Surface roughness		um	0.27	0.20	Gloss surface 0.24 Matte surface 0.36
Melting Point		℃	370
Usable temperature (Continuous use)		℃	260
Feature			Standard	Low Thermal Expansion	・High strength ・High thermal contraction