Semiconductor Production Process Film NITOFLON™ Release Film for TCB(Thermal Compression Bonding) HR-S051
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HR-S051 is a release film compounded polyimide film with fluoroplastic (PTFE) layer. This film has thermal stability from PI (polyimide) with excellent releasability of PTFE. It has splendid heat resistance, mechanical strength, dimensional stability, and releasability. Thin film allows remarkable thermal and electric conduction, and still able to be used in high temperature environment more than 300℃.
Features
- This film has thermal stability (mechanical strength and dimensional strength) from PI (polyimide) with excellent releasability of PTFE.
- This film has splended heat resistance and can be used as release film in high temperature, such as 300℃.
- Thin film allows remarkable thermal and electric conduction.
Structure
Applications
- Release film for semiconductor TCB (Thermal Compression Bonding) process
- Prevent damage on a chip
- Protect pressing plate from sticking excess joint material
Properties
| Item | Unit | Characteristic value | |
|---|---|---|---|
| Thickness | mm | 0.03 | |
| Tensile strength | MPa | 205 | |
| Elongation | % | 50 | |
| Surface roughness (Rmax) | um | 0.5~1 | |
| Thermal conductivity | W/(m-k) | 0.15 | |
|
Dimensional change rate |
MD | % | -0.04 |
| TD | -0.02 | ||
*This data represents examples of measured values, and not guaranteed values.
Experimental video
Heat Resistance
Sliding Properties
Electrical Insulation
Chemical Resistance
Mold Release Properties
Weather Resistance
Semiconductor Production Process Film NITOFLON™ Release Film for TCB(Thermal Compression Bonding) HR-S051
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