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LOCTITE® ECCOBOND FP4530SF

Name: LOCTITE® ECCOBOND FP4530SF
Brand: Hong Teck Hin
Availability: OutOfStock

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描述

LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill

LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.

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