LOCTITE® ECCOBOND FP4526

LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.